PC/ABS Covestro T‑45PG
PC/ABS Covestro T‑45PG
PC/ABS Covestro T‑45PG is a plating‑grade alloy material. It combines the mechanical strength, heat resistance and impact resistance of polycarbonate (PC) with excellent processing flowability of ABS resin, and is especially suitable for electroplating treatment.
Main Applications
Electrical‑Electronic: mobile‑phone housings & accessories, smart cards (SIM‑cards); components for notebooks, digital cameras, air conditioners, refrigerators.
Automotive Parts: surrounding parts of instrument panels, air‑conditioning system components, decorative panels.
Office Equipment: panel parts for copiers, printers and fax machines.
Physical Properties
| Property Category | Test Item | Test Standard | Data | Unit |
|---|---|---|---|---|
| Physical Properties | Density (23°C) | ISO 1183 | 1.10 | g/cm³ |
| MVR (260°C / 5.0 kg) | ISO 1133 | 12.0 | cm³/10min | |
| Molding shrinkage (flow / cross‑flow, 260°C, 3.00 mm) | ISO 2577 | 0.55‑0.75 | % | |
| Water absorption (saturated, 23°C) | ISO 62 | 0.70 | % | |
| Water absorption (equilibrium, 23°C, 50% RH) | ISO 62 | 0.20 | % | |
| Mechanical Properties | Tensile Modulus (23°C) | ISO 527‑2/1 | 2100 | MPa |
| Tensile stress (yield, 23°C) | ISO 527‑2/50 | 49.0 | MPa | |
| Tensile stress (break, 23°C) | ISO 527‑2/50 | 40.0 | MPa | |
| Elongation at break (23°C) | ISO 527‑2/50 | > 50 | % | |
| Izod notched impact strength (23°C) | ISO 180/A | 40 | kJ/m² | |
| Izod notched impact strength (-30°C) | ISO 180/A | 36 | kJ/m² | |
| Thermal Properties | HDT (1.8 MPa, unannealed) | ISO 75‑2/A | 95.0 | °C |
| HDT (0.45 MPa, unannealed) | ISO 75‑2/B | 112 | °C | |
| Vicat softening temperature (B120) | ISO 306 | 112 | °C | |
| Linear thermal expansion coefficient (flow dir., 23‑55°C) | ISO 11359‑2 | 8.5E‑5 | cm/cm/°C | |
| Electrical Properties | Volume resistivity (23°C) | IEC 60093 | 1.0E+16 | Ω·cm |
| Dielectric strength (23°C, 1.00 mm) | IEC 60243‑1 | 35 | kV/mm | |
| CTI | IEC 60112 | 275 | V | |
| Flame Retardancy | UL 94 (0.85 mm) | UL 94 | HB | — |
Processing Parameters
| Process Parameter | Unit | Recommended Value / Range |
|---|---|---|
| Drying Treatment | ||
| Drying temperature | °C | 90‑110 |
| Drying time | h | 2‑4 |
| Residual moisture | % | < 0.04 |
| Injection Molding Temperature | ||
| Rear barrel temperature | °C | 220‑230 |
| Middle barrel temperature | °C | 225‑235 |
| Front barrel temperature | °C | 230‑240 |
| Nozzle temperature | °C | 240‑265 |
| Melt temperature | °C | 240‑270 |
| Mold temperature | °C | 60‑90 |
| Injection Parameters | ||
| Injection speed | — | As high as possible |
| Back pressure | MPa | 5.0‑15.0 |
Note: All information above is for reference only!
